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Foreign matter can cause various defects in electronic circuit boards, so it is important to identify the source. Using HORIBA's μXRF technology, it is possible to identify the elemental species of minute foreign particles and obtain data useful for identifying the source. μXRF can also measure the thickness of thin metal films, and can contribute to controlling the thickness of wiring on electronic boards with a width of several tens of micrometers.
Film Thickness and Quality | Elemental Analysis | Foreign Object Detection/Analysis
In the advancement of thin film technology through miniaturization, we propose solutions for achieving high film deposition control, such as in-situ evaluation during the film deposition process and evaluation of thin films at the Ångström order level.
Membrane information obtained using a spectroscopic ellipsometer
Defects in wafers can also be caused by foreign matter, and we will introduce a method of microscopic elemental analysis to identify the cause of defects.
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X-ray Analytical Microscope (Micro-XRF)
X-ray Analytical Microscope
with a Super Large Chamber
Spectroscopic Ellipsometer from FUV to NIR: 190 to 2100 nm
Reticle / Mask Particle Detection System
