HORIBA launches sales of high-end model of its chemical solution concentration monitor for semiconductor manufacturing systems

With 450 mm wafer production in view, measurement accuracy is doubled for the high temperature cleaning process
Body downsized by 40% enables flexible fitting to form an optimum production system

We are pleased to announce full-scale sales of the CS-600F, the new high-end model in the company’s range of chemical solution concentration monitors. This chemical solution concentration monitor is one of the major products in HORIBA’s semiconductor business, and is used in the wet processes in semiconductor manufacturing, such as wet etching and wet cleaning. As miniaturization and larger diameters of semiconductor, ever more accurate control is required over chemical solution concentrations, which determine the uniformity of surface treatment and, ultimately, manufacturing yield. While increasing installation flexibility within the production system by reducing the equipment volume by 40% compared with conventional models, the CS-600F achieves doubled measurement precision, enabling fast measurement reading even in the high temperature cleaning process operating at 80 degrees C. This model now represents the top end of our line-up. The CS-600F can contribute in improving manufacturing yield, optimizing the production process and for 450 mm wafers process, where chemical solutions are diversifying, through its fast and stable performance within a compact body.

Features of the CS-600F chemical solution concentration monitor

1. Doubled measurement accuracy ensures stable and high precision concentration control, even with high-temperature cleaning liquids
   A completely new set of optical elements and improved computation algorithm has realized a doubling of measurement accuracy compared with our conventional models. This capability eliminates the necessity of a cooling unit, which was previously indispensable for accurate readings on high temperature solution measurement, and significantly reduces the response time to one-third that of existing models.
2. Small body with a 40% size reduction realizes optimum production system layout
   An amazing 40% reduction in size compared with existing models has been achieved with separating the light source unit and the analysis unit. 
3. Reducing production system downtime
   The redesigned optical system significantly reduces the frequency of regular calibrations.

The main specifications