LSC series

Compact Baking System

HORIBA's best-selling baking system has been developed to meet the requirements of today’s high technology industries. Without the need of a carrier gas, the system can provide stable vaporization of materials such as TEOS (at a rate of 600 SCCM) and H2O (at a rate of 2 SLM). For ease of access all device maintenance can be performed from the front of the unit.

Segment: Semiconductor

Division: Fluid Control System

Manufacturing Company: HORIBA STEC, Co., Ltd.

High Flow Rate Gasification
The LSC-A100 provides stable gasification of materials such as TEOS 600SCCM and H2O 2SLM
All device maintenance can be performed at the front of the unit
An optional PocketPC type PDA can be used to monitor the operating conditions of the LSC and to record and analyze operation logs.


Flow rate generated	H2O 2SLM, TEOS 600 SCCM (Max.)
Operating pressure	Max. 1.33kPa
Source tank volume	2.7L
Heat regulation method	PID control by the heat regulator
Liquid surface detection method	Floating switch
Internal mass flow controller	SEC-8400 series
Air pressure valve	Bellows type
Materials in liquid connection and gas contact area	SUS316L, PFA
Operating Temperature	20 to 35°C
External input	Air pressure valve open/close, mass flow controller flow rate setting signal (0 to 5 V DC/0 to 100% F.S.), emergency stop signal, auto zero signal (option)
External output	Temperature alarm, liquid level H.H. alarm, liquid level signal (H, M, L), READY signal, mass flow controller flow rate output signal ((0 to 5 V DC/0 to 100% F.S.), thermoregulated bath internal fan stop alarm, valve voltage monitor (option)
Power source	AC 100 V, single phase 50/60 Hz, 1.5 kVA
Other	Auto-recharge system: Can be connected to LU series.

* The flow rate control range varies with the type of liquid.
* SCCM and SLM are symbols indicating gas flow rate (mL/min, L/min at 0°C, 101.3 kPa).